Comparison of nano-silver solder joints and SAC305 based on ANSYS simulation and life prediction

With the rapid development of microelectronic interconnection technology, reliability requirements electronic products are becoming higher and higher. Among them, temperature has greatest impact on devices. Due to different coefficients thermal expansion (CTE) between many materials a chip, inside solder joint is subjected cyclic action. Under effect temperature, joints subject internal fracture resulting in failure joint. Therefore, it necessary find more reliable material for In this paper, advantages disadvantages pure silver low compared by finite element simulation analysis nano-silver SAC305 material, fatigue life prediction nano-silveris predicted model. Then, using Electric Power Research Institute estimation method estimate joints, results with those calculated method.